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HP Modular Cooling System - overview

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HP Modular Cooling System - Cooling Systems
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Overview

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Overview

The HP Modular Cooling System is the innovative self-cooled rack for high density deployments in the datacenter. HP's new cooling technology makes possible the deployment of up to 30KW in a single rack, bringing hardware densities and power consumption levels that have been difficult, if not impossible, to cool previously.

HP MCS is designed to complement the existing conventional datacenter cooling by adding computing power without adding to the current heat load in the datacenter. In addition, by packing three times the KW capacity of a standard rack, the MCS will extend considerably the life of your datacenter.


What's new

Introducing HP's new Modular Cooling System (MCS) for cooling high density deployments of servers and blades.
Higher cooling capacity of 35kW in a single rack -new-
CTO Capability with 2000 lbs dynamic load -new-
Automatic door release mechanism -new-


Ideal environment


Enterprise datacenters
The MCS is designed for large and medium size enterprises with advanced datacenter environments.
Not ready for MCS? Consider a Site Datacenter Thermal Quick Assessment Service and ask for HB691A1 and HB691AE to improve your current datacenter cooling capacity.


*Except where noted, all prices are estimated U.S. HP prices. Actual prices from other locations or websites may vary.

** Leasing information, where displayed, is for a 48-month lease. Call 1-800-888-5858 to talk to a representative about leasing options to meet your needs. Shipping and tax not included. Details




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